#Techtextil 2026
Future ready nonwovens and fiber processing solutions – Meet Trützschler at Techtextil 2026
From April 21 to 24, 2026, the Trützschler Group will present its future‑ready solutions at Techtextil in Frankfurt, Germany. At Booth C61 in Hall 12.0, Trützschler Nonwovens will showcase its latest developments for efficient nonwovens production, including comprehensive service and consulting solutions. Highlights include the fully upgraded X‑Series nonwoven cards suitable for spunlace, needle‑punching and air‑through bonding (ATB) processes, as well as the T‑ONE digital working environment enhanced with new features. Trützschler Card Clothing will complement the presentation with a new card wire designed with a specially engineered surface for high‑performance nonwoven applications. Visitors can also take a closer look at Trützschler’s complete solution for the recycling of textile waste, TRUECYCLED.







































